Whittemore Hall Cleanroom

The Karl Suss MA-6/BA-6 Mask Aligner is a versatile contact mask aligner, currently tooled for 4" wafer processing. It offers precise alignment and exposure capabilities crucial for high-resolution photolithography, making it an essential tool for semiconductor and MEMS fabrication. This system supports both soft and hard contact printing, ensuring flexibility and accuracy in various photolithographic applications.

The OAI 800E is a sophisticated semiautomatic mask aligner designed for both frontside and backside alignment processes. It is equipped to handle 4" wafers, providing accurate and repeatable photolithographic patterning. This aligner is ideal for advanced microfabrication tasks, offering the precision needed for complex semiconductor processes and research applications.

The SF100 Maskless Photolithography System represents a cutting-edge approach to photolithography by eliminating the need for physical masks. This system is capable of exposing intricate patterns directly onto substrates, providing unmatched flexibility and rapid turnaround for custom microfabrication projects. It supports a wide range of applications, from rapid prototyping to small-scale production, making it an invaluable asset for research and development.

The Kurt J Lesker Plasma Enhanced Atomic Layer Deposition (PEALD) system is designed for the deposition of thin films with atomic-scale precision. By utilizing plasma enhancement, it achieves high-quality, uniform coatings that are essential for various applications in nanotechnology and materials science. This system is suitable for depositing a wide range of materials, ensuring versatility and reliability in producing high-performance nanostructured films.

The Kurt J Lesker PVD-250 E-beam Evaporator is a non-loadlocked system featuring a 4-pocket electron beam source. It is designed for high-precision thin-film deposition of metals and dielectric materials. This evaporator ensures uniform coating and is ideal for applications requiring high-purity films with excellent adhesion properties.

The Kurt J Lesker PVD-75 Sputtering System is equipped with three 2" Torus Sputtering Guns, allowing for the deposition of various metals and dielectrics. This non-loadlocked system provides a versatile and efficient solution for creating thin films with controlled thickness and composition, essential for advanced microfabrication and research.

The SPTS LPX DELTA PECVD system offers state-of-the-art Plasma Enhanced Chemical Vapor Deposition capabilities. It is designed to deposit high-quality dielectric films such as silicon dioxide and silicon nitride. This system ensures excellent film uniformity and adhesion, making it suitable for a wide range of semiconductor and MEMS applications.

The SPTS LPX OMEGA ICP Etcher is a top-tier dry etching system designed for precise etching of oxides, nitrides, and other materials. Its Inductively Coupled Plasma (ICP) technology enables high etch rates with excellent uniformity and selectivity, making it ideal for fabricating complex microstructures and nanostructures.

The SPTS LPX Rapier DRIE (Deep Reactive Ion Etching) system is engineered for high-rate silicon etching, facilitating the creation of three-dimensional structures. This system is essential for applications in MEMS, power devices, and other technologies requiring deep silicon etching with high aspect ratios and smooth sidewalls.

The SPTS Primaxx uetch system utilizes anhydrous HF and alcohol vapor phase etching for releasing MEMS devices and other delicate structures. This system provides a gentle and controlled etching process, minimizing stiction and damage to fragile components, ensuring the reliability and performance of the fabricated devices.

The Samco Reactive Ion Etcher (RIE) is a tabletop system designed for etching with oxygen and fluorocarbon gases. It is suitable for a variety of applications, including the etching of polymers, oxides, and metals. This RIE system offers precise control over etch rates and profiles, making it an invaluable tool for microfabrication.

The Ion Wave 10 Plasma Asher is utilized for the removal of baked-on photoresist or residual organic contaminants. This system employs plasma to achieve thorough and uniform cleaning of substrates, ensuring optimal surface conditions for subsequent processing steps in microfabrication.

The HMDS Vapor Prime Oven is designed to prepare the surface of silicon wafers prior to photolithography. By applying a hexamethyldisilazane (HMDS) layer, this oven enhances photoresist adhesion, improving the quality and reliability of the photolithographic patterns.

The Laurell Spinner WS650 - 1 is a tabletop spinner used for the application of photoresist and other thin films. It provides precise control over spin speed and acceleration, ensuring uniform coating of substrates. This spinner is a critical tool for achieving consistent and reproducible film thicknesses in microfabrication processes.

The Laurell Spinner WS650 - 2 is a tabletop spinner designed for the application of photoresist and other thin films. This system offers precise control over spin speed and acceleration, ensuring uniform coating of substrates. It is essential for achieving consistent film thickness and high-quality photolithographic patterns.

The AML Wafer Bonder AWB-04 is an advanced aligner wafer bonder capable of performing intricate bonding processes. It supports a variety of wafer sizes and bonding techniques, making it ideal for MEMS fabrication and other applications requiring precise wafer alignment and strong bonding.

The Cole Parmer Ovens are general-purpose bake ovens with a maximum temperature of 200°F. They are primarily used for baking and curing processes in microfabrication, providing a stable and controlled environment for reliable and consistent results.

The Yield Engineering Services BCB and Polyimide Baking Oven is a vacuum oven designed for the curing of BCB (benzocyclobutene) and polyimide films. This oven ensures uniform curing, which is essential for achieving optimal film properties and performance in microelectronic and MEMS applications.

The EMS Tabletop Thermal Oxidation Furnace features a 6" ID tube and is designed for the growth of thermal oxide layers on silicon wafers. This furnace ensures uniform oxide thickness and high-quality dielectric properties, which are crucial for semiconductor device fabrication.

The EMS Tabletop Solid Source Doping Furnace, with a 6" ID tube, is used for the doping of silicon wafers using boron and phosphorus sources. This furnace provides precise control over doping concentrations and profiles, essential for tailoring the electrical properties of semiconductor devices.

The Allwin AW-610 M Rapid Thermal Processor is designed for rapid thermal annealing and processing of semiconductor wafers. It offers fast heating and cooling rates, enabling precise control over thermal cycles, which is critical for activating dopants and annealing defects in semiconductor materials.

The High Temperature Vacuum Tube Furnace features a 6" ID and is equipped with nitrogen and oxygen control. It is suitable for a variety of high-temperature processes, including annealing, oxidation, and diffusion, providing a controlled environment for advanced materials processing.

The ADT 7122 Dicing Saw is a substrate singulation system designed to cut various materials with high precision. It is used for the dicing of semiconductor wafers, MEMS devices, and other materials, providing clean and accurate cuts essential for device fabrication and packaging.

The Kulicke & Soffa I 5000 Wire Bonder is a dual wedge and ball bonder equipped for advanced microelectronic packaging. It supports various bonding techniques and materials, ensuring reliable electrical connections and mechanical stability for semiconductor devices.

The Keyence VHX 7000 Digital Microscope is a fully automated system offering 4K enhanced imaging. It provides high-resolution visualization and analysis of microstructures, making it indispensable for quality control, failure analysis, and research in microfabrication.

The Zygo NewView 7100 Profilometer is a non-contact, three-dimensional scanning white light interferometer. It is used for precise surface measurements, providing detailed topographical data essential for characterizing microfabricated structures and ensuring process quality.

The Bruker Dektak XT Profilometer is a stylus-based system for two-dimensional and three-dimensional surface measurements. It offers high accuracy and repeatability, making it ideal for assessing film thickness, surface roughness, and step heights in microfabrication.

The Woollam Ellipsometer is a variable angle system used for thin film measurements. It provides accurate determination of film thickness, refractive index, and other optical properties, essential for the characterization and optimization of thin films in semiconductor and optical applications.

The Shimadzu Spectrophotometer UV-3101 is a PC-based, double-beam spectrophotometer that covers the UV, visible, and near-infrared regions. It is used for the precise measurement of optical properties of materials, essential for characterizing and developing new materials in microfabrication and research.

The Bruker Dimension Icon Atomic Force Microscope (AFM) is equipped with PeakForce Tapping technology, providing high-resolution imaging and nanomechanical property measurements. It is ideal for characterizing surface topography, material properties, and nanoscale features with exceptional accuracy and reliability.

The Keithley 4200A Semiconductor Analyzer is a versatile, four-terminal system designed for measuring I-V (current-voltage), C-V (capacitance-voltage), and other electrical properties of semiconductor devices. It offers advanced features for device characterization, ensuring precise and accurate measurements critical for semiconductor research and development.

The Signatone Four-Point Probe System, coupled with the Keithley 2400 SourceMeter, is used for measuring the bulk resistivity and sheet resistance of materials. This setup provides accurate and repeatable measurements, essential for evaluating the electrical properties of thin films, wafers, and other semiconductor materials.